Feasycom Presents Advanced BLE and LE Audio Solutions at Wireless Japan 2025
15. January 2026At Wireless Japan 2025, held in Tokyo on May 28, Shenzhen Feasycom Technology Co., Ltd. showcased its latest advancements in Bluetooth module technologies, drawing attention from both industry professionals and visitors. Featured prominently at booth W-32, Feasycom introduced next-generation Bluetooth innovations including LE Audio, Bluetooth Angle of Arrival (AoA), and Bluetooth Low Energy (BLE) modules. The LE Audio modules, equipped with the LC3 audio codec, offer low latency, lossless transmission, and reduced power consumption, making them suitable for high-performance, energy-efficient audio applications. Products with Bluetooth functionality and similar usually require TELEC certification in order to be approved for import and sale in Japan.
The BLE modules presented by Feasycom are designed for low power consumption, cost-effectiveness, and high integration flexibility, supporting a wide range of IoT use cases such as smart home systems, industrial automation, medical devices, and instrumentation. According to the company’s Japan Regional Director, Feasycom’s participation in the exhibition aimed to deepen global collaboration and showcase its innovation in wireless communication. Wireless Japan is a key annual trade fair attracting international exhibitors and industry stakeholders, offering a platform for presenting the latest developments in wireless technologies. Feasycom, with over a decade of experience, has distributed its products worldwide, including in the U.S., Europe, and Asia, achieving cumulative shipments in the hundreds of millions.
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